Power chips are linked to outside circuits through product packaging, and their performance depends on the assistance of the packaging. In high-power scenarios, power chips are normally packaged as power components. Chip interconnection describes the electrical link on the top surface area of the chip, which is usually aluminum bonding cable in conventional modules. ^
Standard power component plan cross-section
Currently, commercial silicon carbide power modules still mostly make use of the product packaging innovation of this wire-bonded typical silicon IGBT component. They deal with troubles such as big high-frequency parasitical specifications, insufficient warm dissipation ability, low-temperature resistance, and inadequate insulation toughness, which limit using silicon carbide semiconductors. The screen of superb efficiency. In order to resolve these issues and totally make use of the significant prospective advantages of silicon carbide chips, lots of new packaging innovations and solutions for silicon carbide power modules have emerged recently.
Silicon carbide power module bonding approach
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding materials have actually established from gold wire bonding in 2001 to aluminum wire (tape) bonding in 2006, copper cable bonding in 2011, and Cu Clip bonding in 2016. Low-power devices have actually created from gold cords to copper cords, and the driving force is price decrease; high-power gadgets have actually developed from aluminum wires (strips) to Cu Clips, and the driving force is to improve item performance. The higher the power, the higher the needs.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging process that utilizes a solid copper bridge soldered to solder to connect chips and pins. Compared with typical bonding product packaging approaches, Cu Clip innovation has the complying with benefits:
1. The connection between the chip and the pins is made of copper sheets, which, to a specific level, replaces the common wire bonding approach between the chip and the pins. Therefore, an one-of-a-kind package resistance value, greater existing circulation, and much better thermal conductivity can be obtained.
2. The lead pin welding location does not need to be silver-plated, which can fully conserve the expense of silver plating and inadequate silver plating.
3. The product appearance is entirely consistent with regular products and is primarily used in servers, mobile computer systems, batteries/drives, graphics cards, electric motors, power supplies, and various other areas.
Cu Clip has 2 bonding techniques.
All copper sheet bonding technique
Both eviction pad and the Resource pad are clip-based. This bonding technique is extra expensive and intricate, yet it can attain better Rdson and much better thermal results.
( copper strip)
Copper sheet plus wire bonding technique
The resource pad utilizes a Clip approach, and eviction utilizes a Cord method. This bonding technique is a little more affordable than the all-copper bonding method, conserving wafer area (suitable to really little gateway locations). The process is simpler than the all-copper bonding technique and can acquire far better Rdson and much better thermal effect.
Distributor of Copper Strip
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